首页> 外文会议>Conference on Optical Interconnects XV >A CWDM photoreceiver module for 10 Gb/s × 4ch interconnection based on a vertical-illumination-type Ge-on-Si photodetectors and a silica-based AWG
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A CWDM photoreceiver module for 10 Gb/s × 4ch interconnection based on a vertical-illumination-type Ge-on-Si photodetectors and a silica-based AWG

机译:基于垂直照明型GE-ON-SI光电探测器和基于二氧化硅的AWG的CWDM光致互连的CWDM光致敏感模块

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We report a 40 Gb/s photoreceiver based on vertical-illumination type Ge-on-Si photodetectors and a silica-based AWG demultiplexer by employing 4-channel CWDM. The 60um-diameter Ge-on-Si photodetector arrays, grown on a bulk silicon wafer by RPCVD and fabricated with CMOS-compatible process, have ~0.9 AAV responsivity with 13 GHz bandwidth at λ ~ 1330nm. Ge-on-Si photodetector arrays are hybrid-integrated with TIA/LAs and directly-coupled to the AWG. The low-cost FPCB-package based photoreceiver module shows 10.3 Gb/s × 4-channel interconnection with -11 ~ -12.2 dBm sensitivity at a BER = 10~(-12).
机译:我们通过采用4通道CWDM,基于垂直照明型Ge-on-Si光电探测器和基于二氧化硅的AWG解复用器来报告40 Gb / s的光射。通过RPCVD在散装硅晶片上生长的60um直径Ge-on-Si光电探测器阵列,并用CMOS兼容的工艺制造,具有〜0.9的AAV响应度,在λ〜1330nm处具有13 GHz带宽。 GE-ON-SI光电探测器阵列与TIA / LAS混合集成,并直接耦合到AWG。基于低成本的FPCB封装的光致呼声模块显示了10.3 GB / S×4通道互连,BER = 10〜(-12)的-11〜-12.2 dBm敏感性。

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