Evaluation of Adhesive T-joint Using Finite Element Analysis

摘要

This study evaluates the effect of temperature upon adhesive properties and behavior of adhesively bonded T-joint. Finite element analysis is conducted to study the effect of this parameter on the durability joint and stress distribution within the adhesive layer. A series of temperatures and stress analyses has been performed for the T-joint configuration. The parametric studies on the FE model revealed that stress distributions are sensitive to the changes in adhesive properties due to changes in temperature. Conclusion, stresses were reduced with changes in the temperature which resulted in the ability of the adhesive layer to undergo plastic deformation.