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Preparation of superhydrophobic copper surface by a novel silk-screen printing aided electrochemical machining method

机译:一种新型丝网印刷电化学加工方法制备超疏水铜表面

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A kind of superhydrophobic copper surface with micro-nanocomposite structure has been successfully fabricated by employing a silk-screen printing aided electrochemical machining method. At first silk-screen printing technology has been used to form a column point array mask, and then the microcolumn array would be fabricated by electrochemical machining (ECM) effect. In this study, the drop contact angles have been studied and scanning electron microscopy (SEM) has been used to study the surface characteristic of the workpiece. The experiment results show that the micro-nanocomposite structure with cylindrical array can be successfully fabricated on the metal surface. And the maximum contact angle is 151° when the fluoroalkylsilane ethanol solution was used to modify the machined surface in this study.
机译:通过采用丝网印刷辅助电化学加工方法成功制造了一种具有微纳米复合材料结构的超疏水铜表面。在第一批丝网印刷技术中已被用来形成柱点阵列掩模,然后通过电化学加工(ECM)效应来制造微柱阵列。在该研究中,已经研究了掉落的接触角,并且已经使用扫描电子显微镜(SEM)来研究工件的表面特性。实验结果表明,具有圆柱形阵列的微纳米复合材料结构可以在金属表面上成功制造。当氟代烷基硅烷乙醇溶液用于改变本研究时,最大接触角是151°。

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