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A study on PCD tool surface reconditioning technique for SiC micromachining

机译:SIC微机械线PCD工具表面再处理技术研究

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In this study, ultra-precision machining using a polycrystalline diamond (PCD) micro end mill was carried out on high-purity silicon carbide. The machined surface was observed using scanning electron microscopy, and the three-dimensional surface profile and surface roughness were measured using scanning interferometry. In addition, an elemental analysis of PCD tool surface was performed using energy dispersive X-ray spectrometry (EDX). It was found that a smooth surface with nanometer-scale roughness was obtained when the undeformed chip thickness was small enough to achieve ductile mode machining. However, nanometer-sized chips produced during machining adhered to the PCD tool surface, and were difficult to be removed using conventional methods such as ultrasonic cleaning. An EDX analysis showed that the adhered material was silicon dioxide. In order to remove it, a tool surface reconditioning technique was developed, based on electrolytic treatment using sodium hydroxide and the generation of hydroxide ions. The results indicated that this was effective at removing the adhered material, and led to a recovery of the performance of the PCD tool.
机译:在该研究中,使用多晶金刚石(PCD)微终研磨机的超精密加工在高纯度碳化硅上进行。使用扫描电子显微镜观察加工表面,使用扫描干涉测量测量三维表面曲线和表面粗糙度。另外,使用能量分散X射线光谱法(EDX)进行PCD工具表面的元素分析。发现当未变形的芯片厚度足够小以实现延展模式加工时,获得具有纳米级粗糙度的光滑表面。然而,在加工过程中粘附到PCD工具表面的纳米大小的芯片,并且难以使用诸如超声波清洁的常规方法除去。 EDX分析表明,粘附材料是二氧化硅。为了去除它,基于使用氢氧化钠和氢氧化物离子的电解处理来开发工具表面再处理技术。结果表明,这是有效的去除粘附材料,并导致恢复PCD工具的性能。

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