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Teck Highland Valley Copper's Froth Velocity Improvements with Advance Process Control

机译:Teck Highland Valley铜泡沫速度改进,采用先进的过程控制

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The process control culture at Teck Highland Valley Copper Partnership (THVC) has changed in the last five years. As a part of this culture change, and with the objective of creating sustainable process control solutions, a fully instrumented flotation circuit was commissioned in 2014. The main process variable used to measure the performance of the rougher/scavenger circuit is froth velocity. Froth velocity is the speed at which froth overflows the concentrate lip of a flotation cell. The aim of this work is to present the advance process control (APC) platform and the froth velocity control improvements with a constrained model predictive control (MPC) strategy changes in the rougher/scavenger cells of the bulk copper flotation circuit at THVC. Froth velocity is controlled by manipulating the airflow rate and froth depth in each rougher/scavenger cell. Airflow rate and froth depth were chosen due to the interdependence of these manipulated variables and the capability of predictive controllers to handle variability and process constraints. Since the stability of the process impacts the metallurgical and economic performances of the circuit, an upgrade of the MPC strategy was implemented in 2017. Changes in the control application and froth depth set-point target utilisation were made. These changes have shown an improvement in process performance, increasing recovery average by more than 2 % with 24% lower standard deviation, increasing total froth velocity by 22 % with a 20 % lower standard deviation, and reducing operator interventions in the froth velocity controllers by 47 %. This work has demonstrated the importance of maintaining and expanding a process control culture, confirmed the efficiency of the MPC strategy, and prepared the process for metallurgical real-time optimisation.
机译:Teck Highland Valley Copper合作(THVC)的过程控制文化在过去五年中发生了变化。作为这种文化的一部分,凭借创建可持续流程控制解决方案的目的,2014年委托了一个完全仪表的浮选电路。用于测量粗糙/清除频道性能的主要过程变量是泡沫速度。泡沫速度是泡沫溢出浮选细胞浓缩唇的速度。本作作品的目的是提前处理控制(APC)平台和泡沫速度控制改进,并在THVC的批量铜浮选电路的粗核/清除细胞中改变了粗铜浮选电路的粗晶/清除剂的变化。通过操纵每个粗糙/清除剂细胞中的气流速率和泡沫深度来控制泡沫速度。由于这些操纵变量的相互依存以及预测控制器处理可变性和过程约束的能力,因此选择了气流速率和泡沫深度。由于该过程的稳定性会影响电路的冶金和经济性能,因此2017年实施了MPC策略的升级。对控制应用和泡沫深度设定点目标利用的变化进行了实施。这些变化显示了过程性能的提高,恢复的平均增加了2%以上的标准差24%,增加了22%,标准偏差降低了20%,减少了泡沫速度控制器中的操作员干预措施47%。这项工作表明,保持和扩大过程控制文化的重要性,确认了MPC策略的效率,并准备了冶金实时优化的过程。

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