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Finite Element Simulation of A Novel Nano 3D Semiconductor Detector Fabricated By Anodizing the Aluminium

机译:铝阳极氧化铝制造的新型纳米3D半导体检测器的有限元仿真

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The unique geometry of micro 3D semiconductor detectors, presents several advantages over conventional planar silicon detectors. But, manufacturing these kind of detectors requires high technology. The novel idea to achieve a high performance and low cost semiconductor detector is using the nano pattern of anodized aluminium as a mask to create nano 3D detectors. The simulation results show that this novel nano 3D radiation hard semiconductor detector with collection time less than 10 ps and full depletion voltage less than one volt can become increasingly important for possible future upgrades of 3D detectors of the Large Hadron Collider (LHC) at CERN and also medical imaging applications.
机译:微3D半导体探测器的独特几何形状,呈现出传统的平面硅探测器的几个优点。但是,制造这些探测器需要高科技。实现高性能和低成本半导体检测器的新颖思想是使用阳极氧化铝作为掩模的纳米图案以产生纳米3D探测器。仿真结果表明,该新型纳米3D辐射硬度半导体检测器具有小于10 PS的收集时间和小于一伏的全耗尽电压可能对Cern和Cern的大型Hadron Coller(LHC)的3D探测器可能的未来升级变得越来越重要。还有医学成像应用。

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