Process Signatures-a new approach to solve the inverse surface integrity problem in machining processes

摘要

In industrial practice, the generation of a desired surface integrity of high performance components is still an iterative process based on experience. Despite the findings of researchers correlating the process parameters with the resulting surface integrity, until today, it is not possible to deduce the required process parameters from a given desired surface integrity. This inverse problem shall be addressed by a new approach focusing on process-independent correlations between the thermo-mechanical loads within the workpiece material and the resulting material modifications. The concept of Process Signatures, which aggregate information on material modifications caused by the physical conditions to which a material is subjected to on different levels of scale, are a promising strategy to achieve a knowledge-based solution of the inverse surface integrity problem. This paper presents the current understanding regarding the identification of Process Signatures as well as their potential for future application in practice.