Investigation of Heat Transfer Performances of Nanofluids Flow through a Circular Minichannel Heat Sink for Cooling of Electronics

摘要

Nanofluid is the suspension of nanoparticle in a base fluid. In this paper, the heat transfer performances of the nanofluids flow through a circular shaped copper minichannel heat sink are discussed analytically. Al_2O_3 -water, CuO -water, Cu -water and Ag -water nanofluids were used in this analysis to make comparative study of their thermal performances. The hydraulic diameter of the minichannel is 500 urn and total block dimension is 50mm× 50mm× 4mm. The analysis was done at different volume fractions of the nanoparticle ranging from 0.5 vol.% to 4 vol.%. The results showed that the heat transfer performance increases significantly by the increasing of volume fraction of nanoparticle. Ag -water nanofluid showed the highest performance compared to the other nanofluid. So, this nanofluid can be recommended as a coolant flow through a circular minichannel for cooling of electronic heat sink.