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Heterogeneously integrated Ⅲ-Ⅴ/Si single mode lasers based on a MMI-ring configuration and triplet-ring reflectors

机译:基于MMI形环配置和三重态环反射器的异渗其地集成Ⅲ-ⅴ/ SI单模激光器

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In this paper we show that using a DVS-BCB adhesive bonding process compact heterogeneously integrated Ⅲ-Ⅴ/silicon single mode lasers can be realized. Two new designs were implemented: in a first design a multimode interferometer coupler (MMI) - ring resonator combination is used to provide a comb-like reflection spectrum, while in a second design a triplet-ring reflector design is used to obtain the same. A broadband silicon Bragg grating reflector is implemented on the other side of the cavity. The Ⅲ-Ⅴ optical amplifier is heterogeneously integrated on the 400nm thick silicon waveguide layer, which is compatible with high-performance modulator designs and allows for efficient coupling to a standard 220nm high index contrast silicon waveguide layer. In order to make the optical coupling efficient, both the Ⅲ-Ⅴ waveguide and the silicon waveguide are tapered, with a tip width of the Ⅲ-Ⅴ waveguide of around 500nm. The Ⅲ-Ⅴ thin film optical amplifier is implemented as a 3 μrn wide mesa etched through to the n-type InP contact layer. In this particular device implementation the amplifier section was 500μm long. mW-level waveguide coupled output power at 20°C and a side mode suppression ratio of more than 40dB is obtained.
机译:在本文中,我们显示使用DVS-BCB粘合过程,可以实现Compact异构地集成Ⅲ-ⅴ/硅单模激光器。实施了两种新设计:在第一设计中,使用多模干涉仪耦合器(MMI) - 环谐振器组合来提供梳状反射光谱,而在第二设计中,使用三重态环反射器设计来获得相同的三重环形反射器设计。宽带硅布拉格光栅反射器在腔的另一侧上实施。 Ⅲ-α光学放大器在400nm厚的硅波导层上是异渗透的,其与高性能调制器设计兼容,并且允许有效地耦合到标准的220nm高折射率对比硅波导层。为了使光学耦合有效,Ⅲ-β波导和硅波导都逐渐变细,Ⅲ-ζ波导的尖端宽度约为500nm。 Ⅲ-ⅴ薄膜光学放大器以3μr宽的MESA蚀刻到N型INP接触层。在该特定的设备实现中,放大器部分长500μm。 MW级波导耦合输出功率在20℃和侧面模式抑制比的距离为40dB。

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