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Application of a true bond graph formulation for incompressible thermofluid duct flows

机译:一种真正的粘合图制剂对不可压缩的热流体管道的应用

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In this paper, three advective problems are simulated by applying a previously developed bond graph formulation for thermofluid incompressible duct flows [8]. The methodology was implemented by using constant piecewise shape functions and linear piecewise weight functions for the entropy port. The first two problems consider heating of a fluid flow due to respectively a constant wall heat flux and a constant wall temperature. The third problem considers heating of a fluid flow due to viscous dissipation. The numerical results show an excellent agreement with the analytical solutions for transient flow. A representation with single-bond elements is obtained by lumping the temperature matrix. A simulation was run with the lumping approximation, showing no significant deterioration of the numerical solution.
机译:在本文中,通过施加先前显影的粘合图形制剂来模拟三种平面问题,用于热流体不可压缩管道流量[8]。通过使用恒定的分段形状功能和用于熵端口的线性分段重量函数来实现方法。前两个问题考虑由于分别是恒定壁热通量和恒定壁温而导致的流体流动。第三个问题考虑了由于粘性耗散引起的流体流量的加热。数值结果表明,与瞬态流量的分析解决方案表现出了很好的一致性。通过延伸温度矩阵获得具有单键元件的表示。模拟随着近似的近似进行模拟,显示了数值溶液的显着恶化。

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