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Stripping Photo-Resist with RF Dielectric Barrier Atmospheric Pressure Plasma

机译:用RF介质屏障大气压等离子体剥离光致抗蚀剂

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A novel radio frequency single-dielectric-barrier-discharge atmospheric pressure plasma generator was designed and utilized to strip AZ9912 photo-resist (PR). Argon (Ar) and oxygen (O_2) were employed as the working gases under atmospheric pressure in ambient air. The PR stripping rate was measured as functions of time, input power, and the flow rates of the oxygen/argon. Optical Emission Spectroscopy (OES) was used to measure the optical emission spectra of the plasma to study the mechanism of PR stripping process. It is presumable that C-H bands were broken by high energy electron in the plasma and OH was generated in the process with the participation of O atom. Optical Microscope, Atomic Force Microscope (AFM) and Scanning Electron Microscope (SEM) were used to measure the surface of the silicon substrate after the stripping. It is proved that this kind of novel device could strip the AZ9912 PR effectively as high as 850 nm/min, without residues and ion bombardment damage on the wafer substrate.
机译:设计并利用了一种新型射频单介电阻挡 - 放电大气压等离子体发生器,以剥离AZ9912光致抗蚀剂(PR)。氩气(Ar)和氧气(O_2)作为在环境空气中大气压下的工作气体。将PR汽提速率作为时间,输入功率和氧气/氩气的流速测量。光发射光谱(OES)用于测量等离子体的光发射光谱,以研究PR剥离过程的机理。可以推测C-H波段通过等离子体中的高能电子打破,并且在该过程中产生了O原子的过程。光学显微镜,原子力显微镜(AFM)和扫描电子显微镜(SEM)用于在汽提后测量硅衬底的表面。事实证明,这种新颖的装置可以有效地高达850nm / min的AZ9912 Pr,而没有残留物和离子轰击晶片衬底。

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