Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect (PPT)

摘要

1 Miniturization of electronics has given us 01005 passives and 0.4 to 0.3 mm pitch packages 2 The resulting smaller solder paste deposits = surface powder oxidation 3 Higher process temperatures (i.e. 227C vs 217C) may exacerbate graping (and tombstoning) 4 Dopants such as P and Ge may help (control oxidation).