Real-time non-contact wet or dry thickness measurement of pressure sensitive, water based, hot melt, laminating and other adhesives on multiple substrates - (PPT)

摘要

Robust, high-speed, accurate thickness measurement technology. Flexible technology for diverse set of applications & markets. Excellent results on multiple applications for adhesive coatings. Ability to measure wet or dry adhesives and dual in-process layers. Adhesives on multiple substrates can be more precisely measured such as film, siliconized paper, foil etc. Different types of adhesives can be measured such as solvent based, pressure sensitive, hot melt, water based adhesives, etc.. Fixed point or traversing measurement configurations available.