TEMPERATURE UNIFORMITY AND HEATING RATE SIMULATION OF VAPOR CHAMBER HEAT SPREADER

摘要

In this study, temperature uniformity and heating rate of multi-well vapor chamber heat spreader of different materials were simulated and analyzed by CFD software at natural convection condition.Thermoelectric (TEC) coolers were used as heat sources.Applying single and six heat sources respectively, temperature uniformity and heating rate are studied when the heat spreaders are heated to 95°C.Model size of the heat spreader is 112x75x 17.2mm, and its structure is consisted of upper plate and lower plate.The upper plate is 13.2mm thick, and has 173 holes with a diameter of 5mm and a depth of 10mm for each.The lower plate is rectangular with a thickness of 4mm.The heat spreaders are made of four main materials: copper, silver, aluminum and vapor chamber (VC).Temperature uniformity is assessed by comparing maximum temperature differences of heat spreaders.The simulation results showed that the vapor chamber has better temperature uniformity than other materials because it has higher heat capacity, slower heating rate and higher coefficient of heat conduction.An asymmetric single source heating mode is also developed in the paper.