Characterization of Process Parameters of Adhesive Glue Produced from Leguminous Seeds

摘要

Soy bean and pigeon pea seeds are biodegradable, easily processed, readily available and relatively inexpensive. Owing to the competition in the food chain with soy bean seeds, pigeon pea seeds, because of their resistance to drought and not commonly consumed as soy bean were used to prepare adhesive glue for wood in this study. Analyses such as pH, viscosity, bond strength and moisture content were carried out on the resultant glue samples. The shear strength of the glue was also tested on wood specimens. This study also investigated the effects of calcium carbonate and wood flour fillers on the glue produced. It was discovered that the sample with ordinary soy bean had higher bond strength on wood samples than the glue sample with ordinary pigeon pea. The analyses of results obtained also showed that mixture of defatted soy flour and pigeon pea flour reinforced with calcium carbonate filler showed the highest bond strength. It can therefore be concluded that soybean glue and pigeon pea glue with CaCO_3 filler produced a better alternative for the expensive and importation of glue in the market. Pigeon pea glue can be further modified to meet up with the shear strength of soy based adhesive in the future investigation.