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Spatio-temporal scheduling for 3D reconfigurable multiprocessor architecture

机译:三维可重构和多处理器架构的时空调度

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This article proposes a spatio-temporal scheduling algorithm for a three-dimensional integrated circuits (3D ICs) defined by stacking an homogeneous embedded Field-Programmable Gate Array (eFPGA) above an homogenous Chip MultiProcessor (CMP) layer over through-silicon vias (TSVs) connection. Our proposal, based on Proportionate-fair (Pfair) algorithm, computes the spatio-temporal scheduling of hardware tasks on the reconfigurable resources by taking into account the communication between tasks and then places the associated software tasks on the multiprocessors layer. Compared to the “equivalent” solutions produced by the recursive Branch and Bound (BB) algorithm, our proposal shows up to 14,5% communication cost reduction.
机译:本文提出了一种用于三维集成电路(3D IC)的时空调度算法,通过堆叠通过硅通孔(TSV)上方堆叠均匀嵌入的现场可编程门阵列(EFPGA)上方堆叠均匀的嵌入式现场可编程门阵列(EFPGA)(TSV ) 联系。我们的提议基于比例公平(PFAIR)算法,通过考虑任务之间的通信,计算可重新配置资源上的硬件任务的时空调度,然后将相关联的软件任务放在多处理器层上。与递归分支和绑定(BB)算法产生的“等效”解决方案相比,我们的提案显示出高达14,5%的通信成本降低。

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