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Spatio-temporal scheduling for 3D reconfigurable multiprocessor architecture

机译:3D可重构和多处理器体系结构的时空调度

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This article proposes a spatio-temporal scheduling algorithm for a three-dimensional integrated circuits (3D ICs) defined by stacking an homogeneous embedded Field-Programmable Gate Array (eFPGA) above an homogenous Chip MultiProcessor (CMP) layer over through-silicon vias (TSVs) connection. Our proposal, based on Proportionate-fair (Pfair) algorithm, computes the spatio-temporal scheduling of hardware tasks on the reconfigurable resources by taking into account the communication between tasks and then places the associated software tasks on the multiprocessors layer. Compared to the “equivalent” solutions produced by the recursive Branch and Bound (BB) algorithm, our proposal shows up to 14,5% communication cost reduction.
机译:本文提出了一种用于时空调度算法的三维集成电路(3D IC),该算法是通过在硅通孔(TSV)上的同质芯片多处理器(CMP)层上方堆叠同质嵌入式现场可编程门阵列(eFPGA)来定义的)连接。我们的建议基于比例公平(Pfair)算法,通过考虑任务之间的通信来计算可重配置资源上硬件任务的时空调度,然后将相关的软件任务放置在多处理器层上。与递归分支定界(BB)算法产生的“等效”解决方案相比,我们的建议可将通信成本降低多达14.5%。

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