A study on the application of a low viscosity epoxy resin curing system

摘要

Two novel low viscosity polyamide curing agents are prepared, the viscosity of the polyamide-1 synthesized from adipic acid and tetraethylene pentamine is 12240mPa·s and that of the polyamide-2 synthesized from dimenthy tetrphthalate and tetraethylene pentamine is 11800mPa·s. The effect of synthetic polyamide content on the mechanical performance and thermal performance of the epoxy curing system is studied. The results show that overall performance of the curing system first increases and then decreases with the increase of synthetic polyamide content and reaches maximum with 33 wt% of polyamide. The tensile strength, flexural strength and impact strength of polyamide-1/CYD-128 are 32.41MPa, 81.55MPa and 19.6KJ/m~2, respectively. While that of polyamide-2/CYD-128 are 37.88MPa, 104.60MPa and 16.5KJ/m~2, respectively. This low viscosity curing system can be used as building adhesives due to its excellent mechanical properties.