Study on Improvement of Surface Temperature Uniformity by Bubble Stabilization in Flat-Plate Heat Pipe Hot Chuck

摘要

In the precision hot plate for wafer processing, the temperature uniformity of upper plate surface is one of the key factors affecting the quality of wafers. Precision hot plates require temperature variations less than ±1.5% during heating to 120°C. In this study, we have manufactured the flat plate heat pipe hot chuck of circle type(300mm) and investigated the operating characteristics of flat plate heat pipe hot chuck experimentally. Various screen mesh(40, 80, 120) were used as the structure and chamber was changed.