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Effect of Compaction Pressure on Microstructure and Properties of Copper-based Composite Prepared by Mechanical Alloying and Powder Metallurgy

机译:压实压力对机械合金化和粉末冶金制备的铜基复合材料微观结构及性能的影响

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In this study, copper-tungsten carbide composite was produced by mechanical alloying and powder metallurgy. The compaction pressures were varied from 100 to 600 MPa for observation on microstructure and properties of the composite. The result showed the microstructure was densified with the increased of compaction pressure. Within compaction pressure no fracturing was occurred. Increasing compaction pressure increased the density, hardness and electrical conductivity of the composite which related to the reduced of porosity area.
机译:在该研究中,通过机械合金化和粉末冶金制造铜钨碳化物复合材料。压实压力从100〜600MPa变化,用于观察复合材料的微观结构和性质。结果表明,随着压力压力的增加,致密细胞结构。在压力压力下没有发生压裂。增加压实压力增加了与孔隙度区域的减少相关的复合材料的密度,硬度和导电性。

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