首页> 外文会议>ICoSM 2013 >Current Trend in Simulation: A Study Simulation of Poly-Silicon Nanowire Using COMSOL Multiphysics
【24h】

Current Trend in Simulation: A Study Simulation of Poly-Silicon Nanowire Using COMSOL Multiphysics

机译:仿真的当前趋势:使用COMSOL多发性聚硅纳米线的研究模拟

获取原文

摘要

Poly-Silicon nanowire (Poly-Si-NW) simulations are very important field of nanotechnology and nanostructures; in this paper presented review in general nanowire and it applications such as thermoelectric device (TED) has potential applications in areas such as chip level cooling/ energy harvesting and many more applications in this field .COMSOL multiphysics is one of programmers using for nanotechnology and nanowires simulation, hence in this review paper, COMSOL simulation with different types of materials using for nanowire and other structures. Also In this work, we explore the effect of the electrical contact resistance on the performance of a TED. COMSOL simulations are performed on Poly-SiNW to investigate such effects on its cooling performance. Intrinsically, Poly-SiNW individually without the unwanted parasitic effect has excellent cooling power density. However, the cooling effect is undermined with the contribution of the electrical contact resistance.
机译:聚硅纳米线(Poly-Si-NW)模拟是纳米技术和纳米结构的非常重要的领域;在本文中,纳米线的综述和IT诸如热电装置(TED)的IT应用中的应用在诸如芯片水平冷却/能量收集等领域的潜在应用以及该领域的更多应用.Comsol Multiphysics是用于纳米技术和纳米线的程序员之一因此,仿真在本篇文章纸上,具有用于纳米线和其他结构的不同类型材料的COMSOL模拟。同样在这项工作中,我们探讨了电接触电阻对TED性能的影响。 COMSOL模拟是对Poly-Sinw进行的,以研究对其冷却性能的影响。本质上,在没有不需要的寄生效应的情况下单独地,多征具有优异的冷却功率密度。然而,冷却效果被电接触电阻的贡献破坏。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号