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Metal-Semiconductor-Metal directly illuminated electron detector and secondary electron detector with metal nano-rod array and trench structure to enhance the performance

机译:金属半导体 - 金属直接照明电子检测器和具有金属纳米棒阵列和沟槽结构的二次电子检测器,以提高性能

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摘要

In this work, we first fabricated the conventional metal-semiconductor-metal (MSM) interdigitated electron detector with aluminum contact as the control group, then used e-beam lithography system and reactive ion etcher (RIE) to fabricate aluminum nano-rod array structure on the contact area and used RIE to fabricate the periodic rectangle trench in the active area of the electron detector as another MSM interdigitated electron detector at the same time as the experimental group. According to the experimental data, we found that the MSM electron detectors with aluminum nano-rod array and periodic trench structure had better electricity characteristic and performance as directly illuminated and secondary electron detector.
机译:在这项工作中,我们首先用铝接触制成常规金属半导体 - 金属(MSM)交叉的电子检测器作为对照组,然后使用电子束光刻系统和反应离子蚀刻器(RIE)来制造铝纳米棒阵列结构在接触面积上并使用RIE在电子检测器的有源区中制造周期性矩形沟槽,作为另一种MSM互指的电子检测器作为实验组。根据实验数据,我们发现,具有铝纳米棒阵列和周期性沟槽结构的MSM电子检测器具有更好的电力特性和性能,直接发光和二次电子检测器。

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