首页> 外文会议>International Conference on Machinery Electronics and Control Engineering >Study on Processing Optimization in ultrasonic-assisted grinding of SiCp/Al Thin-walled Workpiece
【24h】

Study on Processing Optimization in ultrasonic-assisted grinding of SiCp/Al Thin-walled Workpiece

机译:SICP / Al薄壁工件超声波辅助研磨加工优化研究

获取原文

摘要

Thin-walled workpieces have the characteristics to withstand a greater load with less material and they are used in aerospace field widely. SiCp/Al composite has high strength and stiffness, which meets the requirements of the aerospace workpieces well. The optimization method is studied with grinding stability and material removal rate as constraint conditions in this paper. The processing parameters optimization of a SiCp/Al thin-walled cylinder is analyzed according to stability lobe diagram. The grinding parameters optimization could be achieved by this method and the chatter could be prevented effectively.
机译:薄壁工件具有承受更大的材料的特性,材料较少,它们用于航空航天领域。 SICP / AL复合材料具有高强度和刚度,符合航空航天工件的要求。通过研磨稳定性和材料去除率作为本文的约束条件研究了优化方法。根据稳定性瓣图分析SICP / Al薄壁圆筒的处理参数优化。通过该方法可以实现研磨参数优化,并且可以有效地防止聊天。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号