首页> 外文会议>International Conference on Advances in Mechanics Engineering >Development of the manufacture equipment for resin bonded diamond abrasive wire saw
【24h】

Development of the manufacture equipment for resin bonded diamond abrasive wire saw

机译:树脂粘结金刚石磨料锯的制造设备的开发

获取原文

摘要

This paper introduces the structure of the resin bonded abrasive wire saw manufacture equipment. The equipment can complete the process of the wire saw production, including uncoiling wire, cleaning wire, binder coating, Pre-curving and coiling wire. Wire saw are manufactured successfully by this equipment in the manufacture experiment. The quality of the wire saw was examined by SEM. The average slicing ability of the wire saw is 205 mm~2 per meter in the experiment of KDP crystal slicing.
机译:本文介绍了树脂粘合磨料锯制造设备的结构。该设备可以完成电线锯生产的过程,包括无法造线,清洗丝,粘合剂涂层,预弯曲和卷绕线。在制造实验中,该设备成功地制造了线锯。通过SEM检查电线锯的质量。在KDP晶体切片的实验中,电线锯的平均切片能力为每米205mm〜2。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号