In order to investigate particle bonding mechanisms of Cold Spray (CS) technique, one of bonding technique, which has similar to the CS bonding mechanism, Surface Activation Bonding (SAB) technique was studied. The SAB activates solid surfaces by removing the oxide layer by using a fast atom beam (FAB), and then joins activated surfaces. In this study, more than 20 combinations of Al, Fe (3N and 4N), SUS304, Zn, Ni and Cu were used for bonding experiments at room temperature. The bonding interfaces were carefully observed by SEM. Al, which can make oxides easily, tended to be hard to bond compared with the other metals. It is thought that Al surfaces can oxidize during FAB treatment. On the other hand, Ni, Zn and Cu, which has low free energy of oxides formation, seemed to be easy to bond. Even if, it is combination with Al, Zn and Cu bond easily. Therefore, the free energy of oxides formation (-ΔG_(300)) and self-diffusion coefficients (D_(300)) are important parameters of bonding for metallic materials at room temperature.
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