Raman spectroscopy; elemental semiconductors; integrated circuit interconnections; integrated circuit metallisation; silicon; synchrotrons; thermal expansion; thermal stresses; thin film devices; three-dimensional integrated circuits; tungsten; Raman spectroscopy; Si; TSV metallization; W; degradation effects; local residual stresses; mechanical constrains; ripple-like morphology; spatial resolution; stress magnitude oscillations; stress state; synchrotron X-ray nanodiffraction; tensile residual stresses; thermal constrains; thermal expansion; thin film; three-dimensional integration possess; through silicon vias; via wall; wafer interconnection; Residual stresses; Silicon; Synchrotrons; Tungsten; X-ray diffraction;
机译:CrN硬质涂层中的残余应力和热疲劳,其特征在于高温同步加速器X射线衍射
机译:利用同步加速器X射线纳米衍射研究CVD TiB_2硬质涂层中压缩残余应力的起源
机译:用微拉曼光谱和X射线衍射分析重掺杂硼的金刚石薄膜的残余应力和晶体质量
机译:用同步加速器X射线纳米衍射和拉曼光谱表征钨包覆的TSV中的局部残余应力
机译:使用常规X射线和同步辐射源的颗粒增强陶瓷复合材料中的残余应力。
机译:斯坦福同步加速器辐射光源上的高分辨率和大立体角X射线拉曼光谱仪终端站
机译:使用经典X射线和同步辐射测量机械抛光钨的残余应力和晶格参数的梯度
机译:电化学表征界面的表面增强拉曼光谱;银电极上硫氰酸盐拉曼光谱的潜在依赖性。