首页> 外文会议>ASME micro/nanoscale heat and mass transfer international conference >THE EFFECTS OF VAN DER WAALS BONDING STRENGTH ON THE IN-PLANE LATTICE THERMAL CONDUCTIVITIES OF MULTILAYER THIN FILMS
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THE EFFECTS OF VAN DER WAALS BONDING STRENGTH ON THE IN-PLANE LATTICE THERMAL CONDUCTIVITIES OF MULTILAYER THIN FILMS

机译:范德瓦尔斯粘接强度对多层薄膜的平面晶格热导体的影响

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A non-equilibrium molecular dynamics (NEMD) simulation model is established to investigate the impact of vdW strength on thermal transport along the in-plane direction in argon bi-layer films (BLFs) and silicon BLFs. Simulation results indicate that higher strength leads to a higher in-plane thermal conductivity. However, interface roughness also increases with the continuous increase of the van der Waals (vdW) strength and leads to the reduction of thermal conductivities. The bonding strength does play an important role in manipulating thermal conductivity of multilayer thin films.
机译:建立了非平衡分子动力学(NEMD)仿真模型,以研究VDW强度对氩气双层膜(BLF)和硅BLF的面内方向热传输的影响。仿真结果表明,更高的强度导致更高的面内导热系数。然而,界面粗糙度也随着范德华(VDW)强度的连续增加而增加,并导致导热率的降低。粘合强度确实在操纵多层薄膜的导热率方面发挥着重要作用。

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