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Study of Processing a New Decorative Light Density Board with Micron Wood Flakes

机译:用微米薄片加工新装饰光密度板的研究

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In this paper, we focused on a new decorative light density board with a new fiber unit- micron wood flake, which were large size in length and a very small size in thickness. With these flakes, we processed the light density board in the laboratory, Cunninghamia lanceolata abounded in Fujian Province, Paulownia tomentosa from Anhui Province, L.gemelini Rupr., and Betulaceae abounded in Northeast of China were selected as raw materials, and modified UF as resin. Then several single factor experiments were conducted to discuss the effects of the factors on the physical and mechanical properties of the board, such as board density, resin content, and species of trees as well. The results showed that the density and resin content had significant effects on the mechanical properties of the board. The physical and mechanical properties of the samples, density ranged from 0.3 to 0.5g/cm~3, reached Japanese Light Particleboard Standard JISA5908, and the thermal conduction of the board processed with the four species tree were just like solid wood.
机译:在本文中,我们专注于一种新的装饰光密度板,具有新的纤维单元微米木片,其长度大,厚度非常小。通过这些薄片,我们在福建省苏宁省兰克纳塔拉省的苏宁哈姆尼亚·普罗尼亚·鲁普洛斯(L.Gemelini Rupr),我们在福建省·普罗尼亚·苏普省波罗尼亚·苏普萨(L.Gemelini),并被选为原料,被选为原料,并修改了福建省树脂。然后进行了几种单一因子实验,讨论了因素对板的物理和力学性能的影响,例如底板密度,树脂含量和树木种类。结果表明,密度和树脂含量对板的机械性能具有显着影响。样品的物理和机械性能,密度范围为0.3至0.5g / cm〜3,达到日本轻型刨花板标准JISA5908,用四种物种树加工的电路板的热传导恰好是实木。

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