首页> 外文会议>Annual Conference of the Australasian Corrosion Association >STUDY OF THE PASSIVITY OF UNS S32003 LEAN DUPLEX STAINLESS STEEL IN NaCl SOLUTION BELOW CRITICAL PITTING TEMPERATURE
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STUDY OF THE PASSIVITY OF UNS S32003 LEAN DUPLEX STAINLESS STEEL IN NaCl SOLUTION BELOW CRITICAL PITTING TEMPERATURE

机译:NaCl溶液中的UNS S32003贫双链不锈钢态度的态度低于临界蚀温度

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In this work we carry out the characterization of two alloys: the lean duplex UNS S32003 and the stainless steel UNS S31603 in NaCl solution at different temperatures; both materials have been used in different applications that require corrosion resistance under chloride environment. The lean duplex alloy favors the mechanical properties while maintaining corrosion resistance and it can be a cost effective alternative to UNS S31603 and UNS S32205 for various applications such as offshore topside structural components and subsea flow-lines. Stainless steels above their specific critical pitting temperature can form different interfacial processes that allow susceptibility to this type of localized corrosion. In this study, the electrochemical performance for UNS S32003 lean duplex steel and UNS S31603 steel is investigated by DC and AC basis techniques. Potentiodynamic polarization tests resolve the active-passive interfacial states at temperatures close to CPT when exposed to higher concentrations of NaCl [1M] is revealing the passive region. Electrochemical impedance spectroscopy (EIS) is used to quantify different mechanisms due to the association of interfacial processes with passive electrical elements. The surface morphologies following DC basis are examined by using stereomicroscopy, and 3D optical microscopy.
机译:在这项工作中,我们对不同温度的NaCl溶液中的瘦双链式UNS S32003和不锈钢UNS S31603进行了表征;两种材料已用于不同的应用,这些应用需要在氯化物环境下进行耐腐蚀性。瘦双面合金合金有利于机械性能同时保持耐腐蚀性,并且可以是UNS S31603和UNS S32205的成本有效的替代方案,用于各种应用,例如海上顶部结构部件和海底流线。在其特定的关键点蚀温度之上的不锈钢可以形成不同的界面过程,允许这种类型的局部腐蚀的易感性。在本研究中,通过DC和AC基础技术研究了UNS S32003贫双链钢和UNS S31603钢的电化学性能。电位动力学偏振试验在暴露于较高浓度的NaCl [1M]时,在接近CPT的温度下解析有源被动界面状态。电化学阻抗光谱(EIS)用于量化由于具有无源电气元件的界面过程的关联而定量的不同机制。通过使用立体镜检查和3D光学显微镜检查DC基础后的表面形态。

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