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Micro-Fabrication Method of Josephson Junctions without Etching Process

机译:没有蚀刻过程的Josephson结的微制造方法

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Intrinsic Josephson junctions (IJJs) were fabricated without etching process by introduction of an oxygen-depleted layer to the surface of the Bi_2Sr_2CaCu_2O_(8+δ) (Bi-2212) single crystal changing the direction of current flow from in-plane (// ab) to out-of-plane (// c). This could be achieved by reducing the surface of the Bi-2212 single crystal. We took two methods to introduce the oxygen-depleted layer into the surface of Bi-2212 single crystal. One method is to introduce the oxygen-depleted layer by annealing the Bi-2212 single crystal in reductive atmosphere of H_2 gas. The Pt or Au electrodes for four-terminal measurement were deposited side by side on the surface of the Bi-2212 single crystal, and the Bi-2212 with electrodes was annealed in Ar+H_2 atmosphere. The resistivity-temperature (ρ-T) characteristics of the Bi-2212 single crystal changed from metallic (dρ/dT > 0) to semiconducting (dρ/dT < 0) behavior by annealing in Ar+H_2 atmosphere. In addition, hysteresis loop and voltage-jump, which are peculiar to IJJs, were observed in the current-voltage (I-V) characteristic of the sample annealed in Ar+H_2 atmosphere. It is known that Bi-2212 single crystals are reduced by H_2 annealing and the superconductivity of the reduced area is suppressed. Therefore, the surface of the Bi-2212 single crystal except for the masked area with the electrodes was reduced by Ar+H_2 annealing. As a result, the change in the direction of the current was caused due to the detour avoiding the reduced area, and IJJs were fabricated. Another method to introduce the oxygen-depleted layer is to deposit metals with low Gibbs free energy and raising the temperature to exceed the activation energy for oxygen ions to move from Bi-2212 single crystal to the metal. We prepared the sample on which Al with low Gibbs free energy was deposited between the voltage terminals. Here, this sample is referred to as Al/Bi-2212 structures. The ρ-T characteristics of the as-prepared Al/Bi-2212 structure showed metallic behavior, whereas the ρ-T characteristics of the Al/Bi-2212 structure showed semiconducting behavior by annealing in Ar atmosphere. Moreover, hysteresis loop and voltage-jump were observed in the I-V characteristic of the annealed Al/Bi-2212 structure in Ar atmosphere. These results show that the direction of current flow is changed from in-plane to out-of-plane by the selective reduction of the Bi-2212 single crystal due to the oxidation of the Al and that IJJs can be fabricated without etching process. The latter method is more advantageous to integration of superconducting circuit due to the high controllability of selective reduction.
机译:通过将氧耗尽层引入Bi_2SR_2CACU_2O_(8 +Δ)(Bi-2212)单晶的表面来制造内在的Josephson结(IJJS)而没有蚀刻工艺(Bi-2212)单晶的单晶改变从平面内的电流方向(// ab)到平面外(// c)。这可以通过减小Bi-2212单晶的表面来实现。我们采取了两种方法将氧耗尽层引入Bi-2212单晶的表面。一种方法是通过在H_2气体的还原气氛中退火Bi-2212单晶来引入氧耗尽层。用于四端子测量的PT或Au电极在Bi-2212单晶的表面上沉积,并且用电极的Bi-2212在Ar + H_2气氛中进行退火。通过在Ar + H_2气氛中退火,Bi-2212单晶的电阻率 - 温度(ρ-t)从金属(Dρ/ dt> 0)变为半导体(dρ/ dt <0)行为。另外,在AR + H_2气氛中退火的样品的电流 - 电压(I-V)特征,观察到IJJS的滞后回路和电压跳跃。已知通过H_2退火减少了BI-2212单晶,并且抑制了减少区域的超导性。因此,除了用电极的掩模区域除了掩蔽区域之外的Bi-2212单晶的表面被Ar + H_2退火减少。结果,由于避免了降低的区域而导致电流方向的变化,并且制造了IJJ。引入氧耗尽层的另一种方法是将金属储存,使得具有低吉布斯的自由能量并提高温度以超过氧离子的活化能量,以从BI-2212单晶移动到金属。我们制备了在电压端子之间沉积有低吉布斯自由能的Al的样品。这里,该样品被称为Al / Bi-2212结构。如制备的Al / Bi-2212结构的ρ-T特征显示了金属行为,而Al / Bi-2212结构的ρ-T特性通过在Ar气氛中退火而显示半导体行为。此外,在AR气氛中的退火Al / Bi-2212结构的I-V特征中观察到滞后回路和电压跳。这些结果表明,由于Al的氧化,通过选择性降低Bi-2212单晶的选择性减少,并且可以在没有蚀刻工艺的情况下制造IJJ的选择性,通过选择性地减少Bi-2212单晶,从平面内部改变。后一种方法对超导电路集成由于选择性降低的高可控性,更有利。

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