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Effect of oxygen plasma etching on graphene's mechanical and electrical properties

机译:氧等离子体蚀刻对石墨烯的机电性能的影响

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This paper reports a study of the effect of oxygen plasma etching on the mechanical and electrical properties of chemical vapor deposited (CVD) multilayer graphene. By means of scan probe microscopy (SPM), it was found that the defects were initially induced to the top graphene layer by oxygen plasma etching, which plays an incentive role in further etching. Oxygen plasma bombarding on surface of graphene enhanced the surface roughness, as well changed the tribological properties. The results of electronic transport measurements show a decrease in mobility with the increase of etching duration. These findings are valuable for studying the effects of plasma etching on graphene, and modifying the physical properties of graphene through artificially generated defects.
机译:本文报道了氧等离子体蚀刻对化学气相沉积(CVD)多层石墨烯机械和电性能的影响的研究。 通过扫描探针显微镜(SPM),发现通过氧等离子体蚀刻最初通过氧等离子体蚀刻诱导缺陷,该缺陷在进一步蚀刻中起着激励作用。 石墨烯表面上的氧等离子体增强了表面粗糙度,改变了摩擦学特性。 电子传输测量的结果显示随着蚀刻持续时间的增加而降低。 这些发现对于研究等离子体蚀刻对石墨烯的影响,并通过人工产生的缺陷改变石墨烯的物理性质。

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