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Fabrication of Insulating Micropatterns for Inner Electrode of Multilayer Ceramic Capacitor by Electrophoretic Deposition Based on SiO_2 Nanopowder

机译:基于SiO_2纳米液的电泳沉积通过电泳沉积制造多层陶瓷电容器内部电极的制造

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Micropatterns of silica were fabricated on interdigitated array (IDA) electrode used to be the insulting layer of inner electrode of multilayer ceramic capacitor (MLCC) by electrophoretic deposition. A three-electrode circuit system was applied to deposit the silica nanoparticle on the silver IDA electrode. The three-electrode system shows better deposition selectively of interval. Smaller IDA electrode spacing performed faster deposition rate and lower applied voltage. A crack-free film of silica was deposited at 10 V applied voltage for 20 s and sintered at 800°C. The resistance of micropattern film is 7 × 10~9 ohm. The adhesion between silica layer and electrode was improved after sintering.
机译:通过电泳沉积在用于是多层陶瓷电容器(MLCC)的内部电极的沉淀层的interdigitated阵列(IDA)电极上制造了二氧化硅的微图案。施加三电极电路系统以将二氧化硅纳米颗粒沉积在银IDA电极上。三电极系统显示间隔选择性更好地沉积。较小的IDA电极间距执行更快的沉积速率和更低的施加电压。在10V施加电压下沉积二氧化硅的无裂缝薄膜20s并在800℃下烧结。微图案薄膜的电阻为7×10〜9欧姆。烧结后,二氧化硅层和电极之间的粘附性得到改善。

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