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Initial electrodeposition behavior of amorphous Ni-P alloys

机译:无定形Ni-P合金的初始电沉积行为

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The growth morphology and structure of deposits during the initial stages of amorphous Ni-P electrodeposition was studied using atomic force microscopy (AFM), X-ray diffraction (XRD) and transmission electron microscope (TEM). Combined electrochemical and surface analytical measurements showed that the electrocrystallization process follows a three-dimensional instantaneous nucleation and growth mechanism. The structure of the Ni-P deposits progressively changed from polycrystalline to amorphous state with increasing electroplating time. Additional electrodeposition was carried out on amorphous carbon film at potential -650mV (SCE) for 5s in the same bath for plating Ni-P alloy. It was confirmed that the formation of crystal Ni at initial stage of electroplating Ni-P amorphous alloy was not caused by the epitaxial relationship between the crystal Ni and the crystal substrate and there was a nucleation process in the electrodeposition of amorphous alloy.
机译:使用原子力显微镜(AFM),X射线衍射(XRD)和透射电子显微镜(TEM)研究了在无定形Ni-P电沉积初始阶段期间沉积物的生长形态和结构。组合电化学和表面分析测量表明,电镀化过程遵循三维瞬时成核和生长机制。 Ni-P沉积物的结构随着电镀时间的增加而逐渐从多晶变为非晶态。在相同浴中的电位-650mV(SCE)的无定形碳膜上进行额外的电沉积,用于电镀Ni-P合金。证实,在电镀Ni-P非晶态合金的初始阶段形成晶体Ni的形成不是由晶体Ni和晶体基质之间的外延关系引起的,并且在非晶合金的电沉积中存在成核过程。

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