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Unique New Thin Film Anodize Technology Superior adhesion Promotion, Bonding and Microfinish One Universal Electrolyte for Type IC, IIB, and III

机译:独特的新型薄膜阳极氧化技术卓越的附着力促进,粘接和微素IC,IIB和III型通用电解质

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Improving the Tartaric Sulfuric (TSA) and Boric Sulfuric (BSA) anodize chemistry so that there would not be any degradation of the anodic coating and/or adverse metallurgical effects on the basis aluminum. This includes protecting the aluminum before, during and after the total anodize process. Improving proper compact pore structure development with the best possible adhesive promotion and microfinish using One Universal Electrolyte/Modifier for Type IC, II, IIB, and Type 23. Developing better Pulse-Step-Ramp Technology so that the TSA Electrolyte/Modifier with only 5% wt sulfuric acid could still be used for superior Type II, IIB and Type III Hard Anodize.
机译:改善酒石酸硫(TSA)和硼硫(BSA)阳极化化学,使得在铝的基础铝上没有任何阳极涂层和/或不利冶金效应的降解。这包括在总阳极氧化过程之前,期间和之后保护铝。使用一种通用电解液/改性剂用于IC,II,IIB和23型的最佳粘合剂促进和微啮合,提高适当的紧凑型孔隙结构开发。开发较好的脉冲阶梯技术,使TSA电解质/修饰符仅为5 %wt硫酸仍可用于高级II,IIB和III型硬阳极氧化。

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