Thermal mapping of Delphi thermal test dies

摘要

The primary purpose of this work was to investigate the relative heat removal effectiveness of various thermal interface and buried oxide materials as they would be used in actual conditions. The thermoreflectance thermography approach was used to measure, non-invasively and with submicron spatial resolution, the surface temperature fields of two types of thermal test devices: (i) Delphi thermal test dies that have been attached to the heat sink with different thermal interface materials and (ii) microresistor test devices built on various buried oxide structures. The temperature maps were used to identify the most thermally efficient material in each of the two types investigated.