Novel modeling strategy for a BCI set-up applied in an automotive application: An industrial way to use EM simulation tools to help hardware and ASIC designers to improve their designs for immunity tests

摘要

Electronics suppliers of automotive industry use BCI (Bulk Current Injection) measurements to qualify immunity robustness of their equipment whereas electronics components manufacturers use DPI (Direct Power Injection) to qualify immunity of their component. Due to harness resonances, levels obtained during a BCI test exceed standard DPI requirements imposed by automotive suppliers onto components' manufacturers. We propose to use BCI set-up modeling to calculate the equivalent DPI level obtained at the component level during equipment testing and to compare results with DPI measurements realized at IC level.