Functional tests of MEMS/MOEMS parallel inspection station 'SMARTIEHS'

摘要

Testing of technical and material properties of M(O)EMS calls for precise measurement tools that allow for non contact and non contaminating inspection. Nowadays, the inspection step is one of the most serious bottlenecks in mass production of M(O)EMS. To remove this bottleneck test equipment needs to overcome the high ratio between required measurement resolution and wafer size. This demand is priority in the design of SMARTIEHS M(O)EMS inspection station.The SMARTIEHS concept is based on a wafer-to-wafer inspection approach [1]. Exchangeable micro-optical probing wafers are adapted to the M(O)EMS wafer under test. The probing wafers contain interferometer arrays. Thus several M(O)EMS structures can be tested within one measurement cycle. This parallel testing approach significantly reduces the measurement time by on an 8 inch wafer. Furthermore different objects parameters can be tested in the same test station by exchanging the probing wafers.