SURFACE FINISHES PCB West 2012 – (PPT)

摘要

Intel has characterized the reliability impact of microvoids on Intel product. Excessive microvoids reduce solder fatigue margin: 1)Temp cycle performance is degraded – Microvoids do not change fail mode or location of cracks, but cause cracks to initiate sooner and propagate faster; – The degree of the effect is based on microvoid density. 2)Board level shock failures have been observed when severe microvoids were present. Excessive microvoids have led to 100% solder joint crack.