Submicron accuracy optimization for laser beam soldering processes

摘要

Laser beam soldering is a packaging technology alternative to polymeric adhesive bonding in terms of stability and functionality. Nevertheless, when packaging especially micro optical and MOEMS systems this technology has to fulfil stringent requirements for accuracy in the micron and submicron range. Investigating the assembly of several laser optical systems it has been shown that micron accuracy and submicron reproducibility can be reached when using designof- experiment optimized solder processes that are based on applying liquid solder drops ("Solder Bumping") onto wettable metalized joining surfaces of optical components. The soldered assemblies were subject to thermal cycles and vibration/ shock test also.