Thermal management is an important criterion in the design for performance and reliability of multichip modules based electronic devices. There is thus, a strong need for the development of novel heat dissipation materials having high thermal conductivity and a CTE compatible with that of the ceramic materials (e.g. alumina or aluminum nitride) which in turn is bonded to the heat source. Since the CTE of the ceramic alumina is about 8 10~(-6) K~(-1), the use of Copper or Aluminum as heat sink with a CTE of 17 10~(-6) K~(-1) and 23 10~(-6) K~(-1) respectively is not acceptable from thermal stresses point of view. Carbon with near-zero CTE, when mixed with Copper or Aluminum can reduce the CTE of the composite to an acceptable level. Table 1 shows the main thermal properties of the Carbon reinforcement that can be used for metal matrix composite materials.
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