Fabrication and Properties of Copper Fiber Porous Surface Used for Heat Transfer

摘要

The copper fiber porous surfaces were prepared on copper plates by sintering process in this paper. The sintering process and the surface treatments of copper fibers and plate were studied to obtain metallurgical bonding from fiber to fiber and fiber to copper plate. The microstructure of porous surfaces and the influences both of process on pore structure, pore structure on heat conduction and pool boiling heat transfer performance were investigated. The results show that the copper fiber porous surfaces prepared on plate had uniform pore structure. The appropriate treatments of copper plate and fibers bonding, optimized sintering processes contribute to metallurgical bonding. Repaving copper powder layer, sintering temperature, porosity, fiber diameter greatly influences on heat transfer properties. Heat transfer coefficient of copper porous materials with optimized processes is much higher than that of plain surface.