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Processing and characterization of composite Shape Memory Alloy (SMA)thin film structures for microactuators

机译:复合形状记忆合金(SMA)薄膜结构的处理与表征微致动器

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The high work to volume ratio and the stress recovery of Shape Memory Alloy (SMA) thin films with temperaturemakes them an ideal choice for microactuators. However, these materials have not gained widespread acceptance due toissues associated with phase transformation. Primary concerns are rapid change in stress at the transformationtemperature giving the actuator a step function like response and a significant shift in transformation temperatures due toa wide hysteresis. In the present research, TiNiCu (53.59at%Ti, 39.05at%Ni), TiNi (50.32at%Ti) and TiNiHf(39.56at%Ti, 48.63at%Ni) composite SMA thin films that display close to linear stress temperature behavior (slope: 2-7MPa/°C) with high stress recovery (300-550MPa), wide transformation range (60-130°C) and low hysteresis (10-30°C)were fabricated. Properties were achieved through the deposition of SMA thin films with varying composition in alayered (composite) format on Si wafers. The TiNi+TiNiCu composite exhibited a two-step transformation (slopes of 2.5and 3.9 MPa/°C) without a significant impact on stress recovery. Displaying identical recovery stresses, the TiNiHf filmpossessed a 65°C transformation range and the TiNiHf+TiNi composite exhibited a wider range of 120°C A strongcorrelation between deposition conditions, annealing parameters and transformation characteristics was observed for allthe SMA films.
机译:高功率比和形状记忆合金(SMA)薄膜的应力恢复与温度造影,它们是微致动器的理想选择。然而,这些材料尚未获得与相变相关的广泛接受。主要问题是转换温度的应力的快速变化,使致动器具有响应的阶梯函数,以及由于宽滞后的转化温度的显着变化。在本研究中,Tinicu(53.59at%Ti,39.05at%Ni),TiNi(50.32at%Ti)和TiniHF(39.56at%Ti,48.63at%Ni)复合SMA薄膜,其显示接近线性应力温度行为(斜坡:2-7MPa /°C)具有高应力恢复(300-550MPa),制备宽的转化范围(60-130°C)和低滞后(10-30°C)。通过在Si晶片上的Alayerated(复合材料)形式中具有不同组合物的SMA薄膜通过SMA薄膜沉积来实现性质。 TINI + TINICU复合材料表现出两步变换(斜坡为2.5和3.9MPa /°C),对应力恢复产生重大影响。显示相同的恢复应力,TINIHF FIMPOSSESSED A 65℃的转化范围和TINIHF + TINI复合材料在沉积条件下较宽的120℃,为所有SMA薄膜观察到退火参数和转化特性之间的强调。

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