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Relationship between metal-assisted chemical etching condition using self-assembled particle mask and obtained morphology- Effect of dry etching process before deposition of catalyst metal

机译:使用自组装颗粒掩模的金属辅助化学蚀刻条件的关系,并获得干蚀刻工艺的形态学 - 催化剂金属沉积前的形态学 -

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Metal assisted chemical etching produces high aspect ratio structure on a silicon substrate and thus expected to be applied to various functional surfaces. The key is patterning of catalyst metal layer of gold. In this study, self-assembly of Φ1 μm particles were used as a mask for deposition of catalyst metal Au, and regular pattern of pits along hexagonal packed structure was produced and then etched. With the increase in etching time, the height of silicon pillars increased and then they got together or aggregated forming bundles of pillars. Dry etching was introduced before Au deposition, and its effect on the morphology was made clear together with other conditions.
机译:金属辅助化学蚀刻在硅衬底上产生高纵横比结构,因此预期将应用于各种功能表面。 该键是催化剂金属层的图案化。 在该研究中,使用φ1μm颗粒的自组装用作用于沉积催化剂金属Au的掩模,并制备沿六边形填充结构的规则的凹坑图案,然后蚀刻。 随着蚀刻时间的增加,硅柱的高度增加,然后它们聚集在一起或聚集成型的柱子。 在Au沉积之前引入了干蚀刻,并且其对形态的影响与其他条件一起清晰。

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