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Application-aware LCA of semiconductors: Life-cycle energy of microprocessors from high-performance 32nm CPU to ultra-low-power 130nm MCU

机译:半导体的应用感知LCA:从高性能32nm CPU到超低功耗130nm MCU的微处理器的生命周期能量

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摘要

The exponential growth of the semiconductor industry raises serious environmental concerns. Accurate life-cycle data are critical for both appropriate product eco-design and life-cycle analysis (LCA) of new electronic applications. Previous semiconductor LCA efforts were based on generic studies dealing with an average component description such as microprocessors, DRAM or Flash memories without taking into account the broad application range of each component. In this paper, we show that accurate life-cycle data can only be obtained with an application-aware approach. We demonstrate this with a life-cycle energy evaluation of microprocessors for five different applications: from high-performance 32 nm CPUs for servers and laptops to low-power 45 nm processors for set-top boxes and smart phones to ultra-low-power 130 nm MCUs for wireless sensors. For each category, we model the energy of the CMOS processing steps for integrated circuit (IC) fabrication as well as the use phase energy demand including both active and stand-by modes. Results show that life-cycle energy varies by a factor 20000× between the high-performance and the ultra-low-power ends.
机译:半导体行业的指数增长引发了严重的环境问题。准确的生命周期数据对于新电子应用的适当产品生态设计和生命周期分析(LCA)至关重要。以前的半导体LCA努力基于通用研究,处理平均分量描述,例如微处理器,DRAM或闪存,而不考虑每个组件的广泛应用范围。在本文中,我们表明,只能以应用程序感知方法获得准确的生命周期数据。我们用5种不同应用的微处理器的生命周期能量评估来证明这一点:从高性能32 nm CPU为服务器和笔记本电脑到低功耗45 NM处理器,用于机顶盒和智能手机到超低功率130 NM MCU为无线传感器。对于每个类别,我们模拟CMOS处理步骤的能量,用于集成电路(IC)制造以及包括主动和备用模式的使用相能量需求。结果表明,生命周期能量因因素20000&#X00D7而异;在高性能和超低功耗之间。

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