The three kind of Ceramics(Al_2O_3, ZrO_2 and AlN) and Copper are soldered by Sn-4Ag-2Ti-0.5Y active solder in the air using ultrasonic vibration Soldering process. The shear strengths of the soldered joints are tested, and the microstructures of soldered joints are observed. The result indicates that the soldered interface between the solder and the ceramic is the weakest part, all the soldered joints are fractured from this zone, not other parts (such as the solder zone, the soldered interface between the solder and copper). Based on the microstructure analysis, good bonded qualities between the solder and two parent materials (the ceramics and copper) are obtained, no flaw appears in the soldered joints, no compound is formed in the soldered interface between the solder and the ceramic, which cause all the fractures happen in this zone, and Cu_6Sn_5 and Cu_3Sn compounds are formed at the soldered interface between the solder and copper. The results are generally essential for the bonding of ceramics with copper.
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