Chip/Package/Board Co-Simulation Methodology for Crosstalk between DC/DC Converter and ADC Input Channels

摘要

In this paper a co-design methodology is proposed to investigate the crosstalk at package-level between the DC/DC converter and the sensitive analog-to-digital converter (ADC) analog input channels of a micro-controller for automotive applications. System-level simulations validated against measurement data confirm that the loop mutual inductance can be used to identify potential crosstalk issue via package nets coupling. Furthermore, a simulation approach at different levels of abstraction is proposed to estimate the rms-noise performance of the ADC when the DC/DC converter is enabled.