Smart systems are used in ever more products. These systems can consist of different subsystems. The interaction of these subsystems is the crucial element to prevent electromagnetic compatibility (EMC) problems. Progressive miniaturisation, complexity and reductions in the operating voltages of smart systems increase the risk of malfunctions due to the higher sensitivity towards ambient noise as well as parasitic field couplings between "aggressive" and "sensitive" subcomponents located very closely to each other. Various measurement techniques (e.g. [1]) are required for the behavioural analysis of an actual microelectronic system unlike its model in terms of radiated and conducted emission characteristics. In the end the measured data should verify the EMC compliant design of the system. In addition to the radiation analysis, the near field scanner is also able to inject electromagnetic interferences with well defined field strength, position and direction that is spatially limited within the test object. This makes efficient reliability investigations possible.
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