The needs of Multi-scale/Multi-physics simulation for RF Power packaging/product development

摘要

High power RF transmitters are essential components for enabling Basestations, Microwave, Boardcast systems. NXP is a leading RF Power supplier for more than 25 years, and our market share gain with volume. In principle, the market demands high power, high frequency and high efficiency with low thermal resistance: Efficiency larger than 30%, frequency in range of 0.7-2.5 GHz or higher, which results in the power dissipation approximately ～200 W. To ensure the device/system working properly, the junction temperature at silicon surface is required less than ～150°C, to ensure the product performance. Considering the reliability requirement (profile) of RF final product, the life time is expect at least 10-20 years in continuous high power loading, and the zero defect is expected. The solder surface mount (for earless product) and bolt down mounting (for eared product, shown in Figure 1(c)) onto PCB boards are both widely applied in the customer side. To secure the low thermal resistance by high heat dissipation efficiency, the ceramic package (as shown in Figure 1(a)-(c)) is the major trend of the RF power products. The IC is mounted on top of the metal heat spreader (header) and semi-hermitic sealed by the sealing cap. The I/O signal path from IC to PCB is enabled by the wiring bonding from IC to lead. The material selection of the metal heat spreader (flange) is the key item in packaging development the flatness of the flange (after the packaging process) is the key item to achieve the low thermal resistance in application. However, the market demands for the cost reduction of the packaging by at least 30-50% die free packaging cost (DPFC) and overmolded plastic packaging for high power/high frequency RF application is developing.