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Dynamic Deadband Control in Semiconductor Manufacturing

机译:半导体制造中的动态死区控制

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This paper proposes efficient control method to minimize process error and to reduce process variance in semiconductor manufacturing. Photo-lithography process make more detailed complex circuit in semiconductor process and is important for quality. However, obstacles were in the process of the facility itself, vibration, wear and tear, and product and process change and environmental impact are difficult to control. In addition, the existing process that is being used for a series of statistical techniques to control the problem was amplified for the change. Therefore, this paper propose effective process control method for reducing process variance by reducing the unnecessary obstacles, quickly detecting changes in the fair, and accurately reflect the degree of change. This study proposes the dynamic deadband control that has a region (band) to detect the status of a process of change and, according to detect changes in the region itself moves the process control. In this research, the semiconductor manufacturing company is supported to perform a more precise control and reduction of fluctuations due to be producing products of uniform quality. Also it can contribute to yield due to the quality incensement, and more and more minted the process control in semiconductor.
机译:本文提出了有效的控制方法来最小化过程误差并降低半导体制造中的过程方差。光光刻工艺在半导体过程中制作更详细的复杂电路,对质量很重要。然而,障碍物在设施本身,振动,磨损和撕裂,以及产品和过程变化和环境影响难以控制。另外,用于控制问题的一系列统计技术的现有过程被放大了改变。因此,本文提出了通过减少不必要的障碍,快速检测公平的变化,准确地反映变化程度的有效过程控制方法来降低过程方差。本研究提出了具有区域(频带)的动态死区控制,以检测变化过程的状态,并且根据检测区域本身的变化移动过程控制。在这项研究中,由于生产均匀质量的产品,支持半导体制造公司的控制更精确控制和减少波动。由于质量活化,并且越来越多的半导体过程控制也可以导致产量贡献。

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