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Dynamic deadband control in semiconductor manufacturing

机译:半导体制造中的动态死区控制

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This paper proposes efficient control method to minimize process error and to reduce process variance in semiconductor manufacturing. Photo-lithography process make more detailed complex circuit in semiconductor process and is important for quality. However, obstacles were in the process of the facility itself, vibration, wear and tear, and product and process change and environmental impact are difficult to control. In addition, the existing process that is being used for a series of statistical techniques to control the problem was amplified for the change. Therefore, this paper propose effective process control method for reducing process variance by reducing the unnecessary obstacles, quickly detecting changes in the fair, and accurately reflect the degree of change. This study proposes the dynamic deadband control that has a region (band) to detect the status of a process of change and, according to detect changes in the region itself moves the process control. In this research, the semiconductor manufacturing company is supported to perform a more precise control and reduction of fluctuations due to be producing products of uniform quality. Also it can contribute to yield due to the quality incensement, and more and more minted the process control in semiconductor.
机译:本文提出了一种有效的控制方法,以最小化工艺误差并减少半导体制造中的工艺差异。光刻工艺使半导体工艺中的电路更加详细,对质量至关重要。但是,设施本身存在障碍,振动,磨损,产品和工艺变更以及环境影响难以控制。此外,针对该变化扩大了用于一系列统计技术以控制问题的现有过程。因此,本文提出了一种有效的过程控制方法,通过减少不必要的障碍,快速检测公平变化并准确反映变化程度来减少过程差异。这项研究提出了一种动态死区控制,该控制具有一个区域(带)以检测变化过程的状态,并根据检测到的变化本身来移动过程控制区域。在这项研究中,支持半导体制造公司执行更精确的控制并减少由于生产质量均匀的产品而引起的波动。此外,由于质量提高,它还可以提高产量,并且越来越多地考虑了半导体的工艺控制。

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